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M34C02-LDW1TP Fiches technique(PDF) 27 Page - STMicroelectronics |
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M34C02-LDW1TP Fiches technique(HTML) 27 Page - STMicroelectronics |
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27 / 31 page ![]() M34C02-W, M34C02-L, M34C02-R Package mechanical 27/31 8 Package mechanical Figure 14. UFDFPN8 (MLP8) 8-lead Ultra thin Fine pitch Dual Flat Package No lead 2x3mm², Package Outline 1. Drawing is not to scale. 2. The central pad (the area E2 by D2 in the above illustration) is pulled, internally, to VSS. It must not be allowed to be connected to any other voltage or signal line on the PCB, for example during the soldering process. Table 15. UFDFPN8 (MLP8) 8-lead Ultra thin Fine pitch Dual Flat Package No lead 2x3mm², Package Mechanical Data Symbol millimeters inches Typ. Min. Max. Typ. Min. Max. A 0.55 0.50 0.60 0.022 0.020 0.024 A1 0.00 0.05 0.000 0.002 b 0.25 0.20 0.30 0.010 0.008 0.012 D 2.00 0.079 D2 1.55 1.65 0.061 0.065 ddd 0.05 0.002 E 3.00 0.118 E2 0.15 0.25 0.006 0.010 e0.50– – 0.020 – – L 0.45 0.40 0.50 0.018 0.016 0.020 L1 0.15 0.006 L3 0.30 0.012 N8 8 D E UFDFPN-01 A A1 ddd L1 e b D2 L E2 L3 |
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