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AND8044/D Fiches technique(PDF) 3 Page - ON Semiconductor |
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AND8044/D Fiches technique(HTML) 3 Page - ON Semiconductor |
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3 / 4 page ![]() AND8044/D http://onsemi.com 3 10–5 120 10–2 10–3 10–4 0 Figure 5. Single 1206A ChipFET 160 Single EVB Min. Footprint TIME (Secs) 40 80 10–1 1 10 100 1000 1” Square PCB SUMMARY The thermal results for the single–channel 1206A ChipFET package display similar power dissipation performance to the SO–8 with a footprint reduction of 80%. Careful design of the package has allowed for this performance to be achieved. The short leads allow the die size to be maximized and thermal resistance to be reduced within the confines of the TSOP–6 body size. |
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