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PHDMI2AB4 Fiches technique(PDF) 10 Page - Nexperia B.V. All rights reserved |
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PHDMI2AB4 Fiches technique(HTML) 10 Page - Nexperia B.V. All rights reserved |
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10 / 14 page ![]() Nexperia PHDMI2AB4 ESD protection for ultra high-speed interfaces 11. Soldering SOT1176-1 Remark: Stencil of 75 m is recommended. A stencil of 75 m gives an aspect ratio of 0.77 With a stencil of 100 m one will obtain an aspect ratio of 0.58 Footprint information for reflow soldering of DFN2510A-10 package solder land plus solder paste occupied area solder land solder paste deposit solder resist Hx By Hy 0.05 C P D 0.05 Ay Dimensions in mm Ay By C D Hy 1.25 0.3 0.475 0.2 P 0.5 1.5 Hx 2.45 Generic footprint pattern Refer to the package outline drawing for actual layout sot1176-1_fr Fig. 16. Reflow soldering footprint for DFN2510A-10 (SOT1176-1) PHDMI2AB4 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2018. All rights reserved Product data sheet 8 June 2018 10 / 14 |
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