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NAND02G-B2C Fiches technique(PDF) 47 Page - STMicroelectronics |
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NAND02G-B2C Fiches technique(HTML) 47 Page - STMicroelectronics |
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47 / 62 page ![]() NAND01G-B2B, NAND02G-B2C DC And AC parameters 47/62 Figure 19. Command Latch AC waveforms 1. The time to Ready depends on the value of the pull-up resistor tied to the Ready/Busy pin. See Figure 31, Figure 32 and Figure 33. 2. tWHWH is the time from W rising edge during the final address cycle to W rising edge during the first data cycle. 3. During a Program/Erase Enable Operation, tWW is the delay from WP high to W High. During a Program/Erase Disable Operation, tWW is the delay from WP Low to W High. 4. ES = Electronic Signature. ai13105 CL E W AL I/O tCLHWH tELWH tWHCLL tWHEH tWLWH tALLWH tWHALH Command tDVWH tWHDX (CL Setup time) (CL Hold time) (Data Setup time) (Data Hold time) (ALSetup time) (AL Hold time) H(E Setup time) (E Hold time) |
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