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MP6606 Fiches technique(PDF) 12 Page - Monolithic Power Systems |
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MP6606 Fiches technique(HTML) 12 Page - Monolithic Power Systems |
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12 / 16 page ![]() MP6606 – 60V, 8-CHANNEL LOW-SIDE DRIVER WITH SERIAL INTERFACE MP6606 Rev. 1.0 MonolithicPower.com 12 3/11/2022 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2022 MPS. All Rights Reserved. APPLICATION INFORMATION Selecting the External Components The MP6606 requires a 100nF, X7R ceramic bypass capacitor at the VIN pin. In addition, place a larger-value ceramic capacitor (4.7µF at minimum) nearby. Additional capacitance may be recommended. For example, if the device is located far away from the other capacitors located at VIN, it is recommended to place an electrolytic bulk capacitor at the input power supply side. The VCLAMP pin dissipates the energy in an inductive load when the current is turned off. Depending on the application, VCLAMP can be connected directly to VIN, or to a TVS diode that is also connected to VIN. Connecting VCLAMP to VIN is equivalent to connecting a diode from each output to VIN. A TVS diode allows the voltage on the output pins to rise above VIN until the TVS diode breaks down. This increased voltage allows the current through the load to decay faster. This is typically recommended for applications with high-speed operation using unipolar stepper motors. Select the TVS diode’s breakdown voltage such that the VCLAMP pin remains below its maximum ratings. Note that TVS breakdown voltage may be higher than expected, as this value is rated for lower currents. For VIN supply voltages of up to 24V, a 24V TVS diode is recommended. That ensures that the VCLAMP pin voltage stays within its limits. PCB Layout Guidelines PCB layout is vital for stable operation. For the best results, follow the guidelines below and refer to Figure 5: 1. Place the bypass capacitors near the IC 2. Place the VCLAMP TVS diode (if used) near the IC. 3. Place thermal vias under the exposed pad to help dissipate heat from the device to a plane either on the inner layer or on the back side of the PCB. Figure 5: Recommended PCB Layout |
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