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DDR Fiches technique(PDF) 3 Page - ATTEND Technology Inc.

No de pièce DDR
Description  This specification covers the requirements for product performance, test methods and quality assurance provisions of DDR Series.
PDF  7 Pages
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Fabricant  ATTEND [ATTEND Technology Inc.]
Site Internet  https://www.attend.com.tw/index.php
Logo ATTEND - ATTEND Technology Inc.

DDR Fiches technique(HTML) 3 Page - ATTEND Technology Inc.

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SPECIFICATION AND PERFORMANCE
SERIES:
DDR Series
FILE:
DDR Series_spec
DATE:
2013/01/04
The information contained herein is exclusive property of. Do not copy and print except that Attend accepts.
本文件係屬立威科技股份有限公司所有;非經同意,不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。
-3 -
Vibration
No electrical
discontinuity greater
than 1 µ second shall
occur.
Solder connectors on PCB and mate them
together, subject to the following vibration
conditions, for a period of 2 hours in each
of 3 mutually perpendicular axes, passing
DC 1mA current during test.
Amplitude: 1.52 mm P-P
Sweep Frequency.: 10 - 55 - 10 Hz /min
[MIL STD. 202F, Method 201A]
Shock
No electrical
discontinuity greater
than 1 μsec shall
occur.
Solder connectors on PCB and mate them
together, subject to the following shock
conditions, 3 shocks shall be period along
3 mutually perpendicular axes, passing DC
1mA current during the test.
(Total of 18 shocks)
Test Pulse :
Half sinusoidal-Peak 490 m/s2 (50G)
Duration: 11 msec.
[MIL STD. 202F, Method 213A]
ENVIRONMENTAL
Item
Requirement
Test Condition
Heat Resistance
Detrimental damage
affecting to the
performance shall not
occur.
Solder connectors on PCB and mate them
together, expose to 85±2℃ for 96hours.
Upon completion of the exposure period,
the test specimens shall be conditioned at
ambient room conditions for 1 to 2 hours,
after which the specified measurements
shall be performed.
[MIL STD. 202F, Method 108A]



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