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M58BW16F Fiches technique(PDF) 61 Page - STMicroelectronics |
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M58BW16F Fiches technique(HTML) 61 Page - STMicroelectronics |
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61 / 81 page ![]() M58BW16F, M58BW32F Package mechanical 61/81 8 Package mechanical In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second-level interconnect. The category of Second-Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 22. LBGA80 10 × 12mm - 8 × 10 ball array, 1mm pitch, bottom view package outline 1. Drawing is not to scale. E1 E D1 D eb A2 A1 A BGA-Z05 ddd FD FE SD SE e BALL "A1" |
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