UPD17P236M3 datasheet(28/34 Pages) RENESAS

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µPD17P236

Data Sheet U14776EJ1V0DS00

(2)

µPD17P236M1MC-5A4: 30-pin plastic SSOP (7.62 mm (300))

µPD17P236M2MC-5A4: 30-pin plastic SSOP (7.62 mm (300))

µPD17P236M3MC-5A4: 30-pin plastic SSOP (7.62 mm (300))

µPD17P236M4MC-5A4: 30-pin plastic SSOP (7.62 mm (300))

Soldering Method

Soldering Conditions

Symbol

Intrared reflow

Package peak temperature: 235

°C, Time: 30 seconds max. (210°C min.),

IR35-103-2

Number of times: 2 max. Number of days: 3

Note (after that, prebaking is

necessary at 125

°C for 10 hours)

Non-heat-resistant trays, such as magazine and taping trays, cannot be baked

before unpacking.

VPS

Package peak temperature: 215

°C, Time: 40 seconds max. (200°C min.),

VP15-103-2

Number of times: 2 max. Number of days: 3

Note (after that, prebaking is

necessary at 125

°C for 10 hours)

Non-heat-resistant trays, such as magazine and taping trays, cannot be baked

before unpacking.

Wave soldering

Solder bath temperature: 260

°C max, Time: 10 seconds max., Number of times:

WS60-103-1

once, preheating temperature: 120

°C max. (package surface temperature)

Number of days: 3

Note (after that, prebaking is necessary at 125

°C for 10 hours)

Partial heating

Pin temperature: 300

°C max., Time: 3 seconds max. (per side of device)

—

Note

After opening the dry pack, store it at 25

°C or less and 6.5 % RH or less for the allowable storage period.

Caution Do not use different soldering methods together (except for partial heating).

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