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PIC16LC505-20/P Fiches technique(PDF) 72 Page - Microchip Technology |
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PIC16LC505-20/P Fiches technique(HTML) 72 Page - Microchip Technology |
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72 / 80 page ![]() PIC16C505 DS40192A-page 72 Preliminary © 1998 Microchip Technology Inc. Package Type: 14-Lead Ceramic Side Brazed Dual In-line with Window (JW) – 300 mil n 1 2 0.260 0.440 0.161 0.310 0.280 0.680 0.130 0.025 0.103 0.145 0.008 0.050 0.016 0.098 MIN Window Diameter Overall Row Spacing Package Length Tip to Seating Plane Base to Seating Plane Top of Body to Seating Plane Top to Seating Plane Upper Lead Width Lower Lead Width PCB Row Spacing Dimension Limits Lid Length Lid Width Package Width Lead Thickness Number of Pins Pitch Units T U D W eB E A2 A1 L B A c B1 p n 0.450 0.270 0.700 0.166 0.338 0.290 0.140 0.035 0.123 0.460 0.280 0.171 0.365 0.300 0.720 0.150 0.045 0.143 14 NOM 0.018 0.165 0.010 0.055 0.100 0.300 MAX 0.185 0.012 0.060 0.020 0.102 6.86 11.43 4.22 8.57 7.37 17.78 3.56 0.89 3.12 11.18 6.60 17.27 4.09 7.87 7.11 3.30 0.64 2.62 11.68 7.11 18.29 4.34 9.27 7.62 3.81 1.14 3.63 4.19 0.25 1.40 0.46 2.54 7.62 NOM MILLIMETERS MIN 0.41 3.68 0.20 1.27 2.49 MAX 14 0.51 4.70 0.30 1.52 2.59 D T E U W c eB L A1 B B1 A A2 p INCHES* * Controlling Parameter. |
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