TC1017 datasheet(14/22 Pages) MICROCHIP

No de pièce	TC1017

Description	150 mA, Tiny CMOS LDO With Shutdown

PDF	22 Pages

Scroll/Zoom	100%

Fabricant	MICROCHIP [Microchip Technology]

Site Internet	http://www.microchip.com

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14 / 22 page

TC1017

DS21813B-page 14

 2003 Microchip Technology Inc.

FIGURE 5-3:

Power Dissipation vs.

Ambient Temperature (SOT-23 Package).

FIGURE 5-4:

Maximum Current vs.

Ambient Temperature (SOT-23 Package).

5.4

Layout Considerations

The primary path for heat conduction out of the SC-70

or SOT-23 package is through the package leads.

Using heavy wide traces at the pads of the device will

facilitate the removal of the heat within the package,

thus lowering the thermal resistance R

θJA. By lowering

the thermal resistance, the maximum internal power

dissipation capability of the package is increased.

FIGURE 5-5:

SC-70 Package Suggested

Layout.

100

200

300

400

500

600

700

-40

-15

110

Ambient Temperature (°C)

100

120

140

160

-40

-15

110

Ambient Temperature (°C)

VIN - VOUT = 1V

SHDN

OUT

GND

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