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FS781/82/84
Document #: 38-07029 Rev. *E
Page 11 of 12
© Cypress Semiconductor Corporation, 2005. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
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All product and company names mentioned in this document may be the trademarks of their respective holders.
Package Drawing and Dimensions (continued)
8
PIN1ID
SEATING
PLANE
1
BSC.
BSC
0°-8°
PLANE
GAUGE
2.90[0.114]
1.10[0.043] MAX.
0.65[0.025]
0.20[0.008]
0.05[0.002]
6.50[0.256]
0.076[0.003]
6.25[0.246]
4.50[0.177]
4.30[0.169]
3.10[0.122]
0.15[0.006]
0.19[0.007]
0.30[0.012]
0.09[[0.003]
0.25[0.010]
0.70[0.027]
0.50[0.020]
0.95[0.037]
0.85[0.033]
DIMENSIONS IN MM[INCHES] MIN.
MAX.
8-Lead Thin Shrunk Small Outline Package (4.40 MM Body) Z8
51-85093-*A
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