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33982 Fiches technique(PDF) 30 Page - NXP Semiconductors |
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33982 Fiches technique(HTML) 30 Page - NXP Semiconductors |
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30 / 47 page ![]() 30 NXP Semiconductors 33982 PACKAGING Packaging Soldering information SOLDERING INFORMATION The 33982 is packaged in a surface mount power package (PQFN), intended to be soldered directly on the printed circuit board. The AN2467 provides guidelines for Printed Circuit Board design and assembly. Package dimensions For the most current revision of the package, visit www.nxp.com and perform a keyword search on 98ARL10596D and 98ASA00815D. Dimensions shown are provided for reference ONLY. Table 19. Suffix Package outline drawing number CHFK 98ARL10521D EHFK 98ASA00815D |
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