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AD9237 Fiches technique(PDF) 28 Page - Analog Devices

No de pièce AD9237
Description  12-Bit, 20 MSPS/40 MSPS/65 MSPS 3 V Low Power A/D Converter
PDF  28 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Fabricant  AD [Analog Devices]
Site Internet  http://www.analog.com
Logo AD - Analog Devices

AD9237 Fiches technique(HTML) 28 Page - Analog Devices

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AD9237
Rev. 0 | Page 28 of 28
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
0.30
0.23
0.18
0.20 REF
0.80 MAX
0.65 TYP
0.05 MAX
0.02 NOM
12° MAX
1.00
0.85
0.80
SEATING
PLANE
COPLANARITY
0.08
1
32
8
9
25
24
16
17
0.50
0.40
0.30
3.50 REF
0.50
BSC
PIN 1
INDICATOR
TOP
VIEW
5.00
BSC SQ
4.75
BSC SQ
3.25
3.10 SQ
2.95
PIN 1
INDICATOR
0.60 MAX
0.60 MAX
0.25 MIN
EXPOSED
PAD
(BOTTOM VIEW)
Figure 57. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
5 mm × 5 mm Body, Very Thin Quad
(CP-32-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model
Temperature Range
Package Description
Package Option
AD9237BCPZ-201, 2
–40°C to +85°C
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
CP-32-2
AD9237BCPZRL7-201, 2
–40°C to +85°C
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
CP-32-2
AD9237BCPZ-401, 2
–40°C to +85°C
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
CP-32-2
AD9237BCPZRL7-401, 2
–40°C to +85°C
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
CP-32-2
AD9237BCPZ-651, 2
–40°C to +85°C
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
CP-32-2
AD9237BCPZRL7-651, 2
–40°C to +85°C
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
CP-32-2
AD9237BCP-20EB
Evaluation Board
AD9237BCP-40EB
Evaluation Board
AD9237BCP-65EB
Evaluation Board
T
1 Z = Pb-free part.
2 It is recommended that the exposed paddle be soldered to the ground plane. There is an increased reliability of the solder joints and maximum thermal capability of
the package is achieved with exposed paddle soldered to the customer board.
© 2005 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D05455–0–10/05(0)
TTT



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