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AD8336ACPZ-R7 Fiches technique(PDF) 28 Page - Analog Devices

No de pièce AD8336ACPZ-R7
Description  General-Purpose, ??5 to 125, Wide Bandwidth, DC-Coupled VGA
PDF  28 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Fabricant  AD [Analog Devices]
Site Internet  http://www.analog.com
Logo AD - Analog Devices

AD8336ACPZ-R7 Fiches technique(HTML) 28 Page - Analog Devices

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AD8336
Rev. 0 | Page 28 of 28
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-220-VGGC
2.25
2.10 SQ
1.95
16
5
13
8
9
12
1
4
1.95 BSC
PIN 1
INDICATOR
TOP
VIEW
4.00
BSC SQ
3.75
BSC SQ
COPLANARITY
0.08
EXPOSED
PAD
(BOTTOM VIEW)
12° MAX
1.00
0.85
0.80
SEATING
PLANE
0.35
0.30
0.25
0.80 MAX
0.65 TYP
0.05 MAX
0.02 NOM
0.20 REF
0.65 BSC
0.60 MAX
0.60 MAX
PIN 1
INDICATOR
0.25 MIN
0.75
0.60
0.50
THE EXPOSED PAD IS NOT CONNECTED
INTERNALLY. FOR INCREASED RELIABILITY
OF THE SOLDER JOINTS AND MAXIMUM
THERMAL CAPABILITY, IT IS RECOMMENDED
THAT THE PADDLE BE SOLDERED TO THE
GROUND PLANE.
Figure 90. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad
(CP-16-4)
Dimensions shown in millimeters
ORDERING GUIDE
Model
Temperature Range
Package Description
Package Option
AD8336ACPZ1
−40°C to +85°C
16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
CP-16-4
AD8336ACPZ-R71
−40°C to +85°C
16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
CP-16-4
AD8336ACPZ-RL1
−40°C to +85°C
16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
CP-16-4
AD8336ACPZ-WP1
−40°C to +85°C
16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
CP-16-4
AD8336-EVALZ1
Evaluation Board
1 Z = Pb-free part.
©2006 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D06228-0-10/06(0)



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