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AD8317ACPZ-R2 Fiches technique(PDF) 19 Page - Analog Devices |
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AD8317ACPZ-R2 Fiches technique(HTML) 19 Page - Analog Devices |
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19 / 20 page ![]() AD8317 Rev. 0 | Page 19 of 20 OUTLINE DIMENSIONS 0.30 0.23 0.18 SEATING PLANE 0.20 REF 0.80 MAX 0.65 TYP 1.00 0.85 0.80 1.89 1.74 1.59 0.50 BSC 0.60 0.45 0.30 0.55 0.40 0.30 0.15 0.10 0.05 0.25 0.20 0.15 BOTTOM VIEW * 4 1 58 3.25 3.00 2.75 1.95 1.75 1.55 2.95 2.75 2.55 PIN 1 INDICATOR 2.25 2.00 1.75 TOP VIEW 0.05 MAX 0.02 NOM 12° MAX EXPOSED PAD Figure 39. 8-Lead Lead Frame Chip Scale Package [LFCSP_VD] 2 mm x 3 mm Body, Very Thin, Dual Lead (CP-8-1) Dimensions shown in millimeters ORDERING GUIDE Model Temperature Range Package Descripti on Package Option Branding AD8317ACPZ-R71 −40°C to +85°C 8-Lead LFCSP_VD CP-8-1 Q1 AD8317ACPZ-R21 −40°C to +85°C 8-Lead LFCSP_VD CP-8-1 Q1 AD8317ACPZ-WP1, 2 −40°C to +85°C 8-Lead LFCSP_VD CP-8-1 Q1 AD8317-EVAL Evaluation Board 1 Z = Pb-free part. 2 WP = waffle pack. |
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