AD8189ARUZ-R7 datasheet(5/24 Pages) AD

5 / 24 page

AD8188/AD8189

Rev. 0 | Page 5 of 24

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter1

Rating

Supply Voltage

5.5 V

DVCC to DGND

5.5 V

DVCC to VEE

8.0 V

VCC to DGND

8.0 V

IN0A, IN0B, IN1A, IN1B, IN2A, IN2B, VREF

VEE ≤ VIN ≤ VCC

SEL A/B, OE

DGND ≤ VIN ≤ VCC

Output Short-Circuit Operation

Indefinite

Operating Temperature Range

–40°C to +85°C

Storage Temperature Range

–65°C to +150°C

Lead Temperature Range (Soldering, 10 sec)

300°C

1 Specification is for device in free air (TA = 25°C).

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 3. Thermal Resistance

Package Type

θJA2

θJC

Unit

24-Lead TSSOP1

°C/W

1 Maximum internal power dissipation (PD) should be derated for ambient

temperature (TA) such that PD < (150°C TA)/θJA.

2 θJA is on a 4-layer board (2s 2p).

MAXIMUM POWER DISSIPATION

The maximum safe junction temperature for plastic encapsulated

devices is determined by the glass transition temperature of the

plastic, approximately 150°C. Temporarily exceeding this limit

may cause a shift in parametric performance due to a change in

the stresses exerted on the die by the package. Exceeding a

junction temperature of 175°C for an extended period can

result in device failure.

While the AD8188/AD8189 is internally short circuit protected,

this may not be sufficient to guarantee that the maximum junction

temperature (150°C) is not exceeded under all conditions. To

ensure proper operation, it is necessary to observe the

maximum power derating curves shown in Figure 3.

2.5

2.0

1.5

1.0

0.5

–50 –40 –30 –20 –10 0

102030405060708090

AMBIENT TEMPERATURE (°C)

Figure 3. Maximum Power Dissipation vs. Temperature

ESD CAUTION

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