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ADN2821 Fiches technique(PDF) 7 Page - Analog Devices |
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ADN2821 Fiches technique(HTML) 7 Page - Analog Devices |
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7 / 8 page ![]() Preliminary Technical Data ADN2821 Rev. PrL | Page 7 of 8 ASSEMBLY RECOMMENDATIONS 560pF 200pF 1000pF VPD VCC OUTB OUT Figure 3. 5-Pin TO-46 w/External Photodiode Supply VPD • 1× VENDOR SPECIFIC (0.3mm × 0.3mm) 10.0Gbps Photo Diode • 1× ADN2821 (0.7mm × 1.2mm) Analog Devices SiGe 10.0Gbps Trans-Impedance Amplifier • 200pF RF Single Layer Capacitor • 560pF RF Single Layer Capacitor • 1000pF Ceramic Cap Notes: 1. Minimize all GND bond wire lengths. 2. Minimize IN, FILTER, OUT and OUTB bond wire lengths. 3. Maintain symmetry in length and orientation between IN and FILTER bond wires. 4. Maintain symmetry in length and orientation between OUT and OUTB bond wires. 5. Maintain symmetry between IN/FILTER and OUT/OUTB bond wires. |
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