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1.60mm

1.90mm

5.93mm

5.78mm

7.31mm

5.40mm

0.69mm

0.075mm

0.28mm

0.075mm

0.5mm

0.33mm DIAMETER

THERMAL VIA

HEAT SINK

SOLDER PASTE AREA

1.60mm

Figure 24. 48-Pin LFCSP (CP-48) Land Pattern—Dimensions Shown in Millimeters

Notes:

1.

Areas in black represent the board metallization.

2.

Areas in white represent the solder mask and vias.

3.

Hatched area is for the heat sink solder paste.

4.

The thermal pad is electrically active. The solder mask opening should be 0.150 mm larger than the pad size, resulting in 0.075 mm

of clearance between the copper pad and solder mask.