| Moteur de recherche de fiches techniques de composants électroniques |
|
BLW77 Fiches technique(PDF) 13 Page - NXP Semiconductors |
|
|
|||||||||||||||||||||||||||||
BLW77 Fiches technique(HTML) 13 Page - NXP Semiconductors |
|
13 / 17 page ![]() August 1986 13 Philips Semiconductors Product specification HF/VHF power transistor BLW77 The circuit and the components are situated on one side of the epoxy fibre-glass board, the other side being fully metallized to serve as earth. Earth connections are made by means of hollow rivets, whilst under the emitter leads Cu straps are used for a direct contact between upper and lower sheets. Fig.17 Component layout and printed-circuit board for 87,5 MHz test circuit. handbook, full pagewidth MGP536 65 116 C1 C2 C3 C4 R1 C6 C5 C8 C9 C10 +VCC R2 C7b C7a L4 L1 L6 L8 L7 L3 rivet strip L2 L5 |
|
|
Lien URL |
| ALLDATASHEET vous a-t-il été utile ? [ DONATE ] |
À propos de Alldatasheet | Publicité | Contactez-nous | Politique de confidentialité | Lien vers la fiche technique | Echange de liens | Fabricants All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |