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BLF545 Fiches technique(PDF) 3 Page - NXP Semiconductors

No de pièce BLF545
Description  UHF push-pull power MOS transistor
PDF  12 Pages
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Fabricant  PHILIPS [NXP Semiconductors]
Site Internet  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

BLF545 Fiches technique(HTML) 3 Page - NXP Semiconductors

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October 1992
3
Philips Semiconductors
Product specification
UHF push-pull power MOS transistor
BLF545
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC 134).
Per transistor section unless otherwise specified.
THERMAL RESISTANCE
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VDS
drain-source voltage
−
65
V
±V
GS
gate-source voltage
−
20
V
ID
DC drain current
−
3.5
A
Ptot
total power dissipation
up to Tmb =25 °C; total device;
both sections equally loaded
−
92
W
Tstg
storage temperature
−65
150
°C
Tj
junction temperature
−
200
°C
SYMBOL
PARAMETER
CONDITIONS
THERMAL
RESISTANCE
Rth j-mb
thermal resistance from junction to
mounting base
total device; both sections equally
loaded
1.9 K/W
Rth mb-h
thermal resistance from mounting
base to heatsink
total device; both sections equally
loaded
0.25 K/W
Fig.2 DC SOAR.
(1) Current in this area may be limited by RDS(on).
(2) Tmb =25 °C.
Total device; both sections equally loaded.
handbook, halfpage
1
10
110
MRA995
102
102
(1)
ID
(A)
VDS (V)
(2)
Fig.3 Power/temperature derating curves.
(1) Short-time operation during mismatch.
(2) Continuous operation.
Total device; both sections equally loaded.
handbook, halfpage
0
(1)
(2)
40
80
Ptot
(W)
160
120
40
0
80
120
MBK463
Th ( °C)



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