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ADL5530ACPZ-R7 Fiches technique(PDF) 12 Page - Analog Devices |
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ADL5530ACPZ-R7 Fiches technique(HTML) 12 Page - Analog Devices |
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12 / 12 page ![]() ADL5530 Rev. 0 | Page 12 of 12 OUTLINE DIMENSIONS 0.30 0.23 0.18 SEATING PLANE 0.20 REF 0.80 MAX 0.65 TYP 1.00 0.85 0.80 1.89 1.74 1.59 0.50 BSC 0.60 0.45 0.30 0.55 0.40 0.30 0.15 0.10 0.05 0.25 0.20 0.15 BOTTOM VIEW 4 1 58 3.25 3.00 2.75 1.95 1.75 1.55 2.95 2.75 2.55 PIN 1 INDICATOR 2.25 2.00 1.75 TOP VIEW 0.05 MAX 0.02 NOM 12° MAX EXPOSEDPAD Figure 26. 8-Lead Lead Frame Chip Scale Package [LFCSP_VD] 2 mm × 3 mm Body, Very Thin, Dual Lead CP-8-1 Dimensions shown in millimeters ORDERING GUIDE Model Temperature Range Package Description Package Option Branding Ordering Quantity ADL5530ACPZ-R7 −40°C to +85°C 8-Lead LFCSP_VD, 7”Tape and Reel CP-8-1 OT 1500 1 ADL5530ACPZ-WP −40°C to +85°C 8-Lead LFCSP_VD, Waffle Pack CP-8-1 OT 50 1 ADL5530-EVAL Evaluation Board 1 1 Z = Pb-free part. ©2006 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D05834-0-7/06(0) |
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