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BLF2045 Fiches technique(PDF) 8 Page - NXP Semiconductors |
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BLF2045 Fiches technique(HTML) 8 Page - NXP Semiconductors |
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8 / 11 page ![]() 1999 Dec 06 8 Philips Semiconductors Preliminary specification UHF power LDMOS transistor BLF2045 Fig.9 Component layout for 2 GHz class-AB test circuit. Dimensions in mm. The components are situated on one side of the copper-clad printed-circuit board with Teflon dielectric ( εr = 6.15), thickness 0.64 mm. The other side is unetched and serves as a ground plane. F1 C5 C3 C7 C8 C9 C10 R2 C13 C14 C15 C12 C11 C16 R1 C4 C2 C1 C6 BLF2045 OUTPUT BLF2045 INPUT BLF2045 OUTPUT BLF2045 INPUT 50 60 50 60 |
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