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LT6204IGN Fiches technique(PDF) 23 Page - Linear Technology |
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LT6204IGN Fiches technique(HTML) 23 Page - Linear Technology |
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23 / 24 page ![]() LT6202/LT6203/LT6204 23 620234fa PACKAGE DESCRIPTIO S5 Package 5-Lead Plastic TSOT-23 (Reference LTC DWG # 05-08-1635) 1.50 – 1.75 (NOTE 4) 2.80 BSC 0.30 – 0.45 TYP 5 PLCS (NOTE 3) DATUM ‘A’ 0.09 – 0.20 (NOTE 3) S5 TSOT-23 0302 PIN ONE 2.90 BSC (NOTE 4) 0.95 BSC 1.90 BSC 0.80 – 0.90 1.00 MAX 0.01 – 0.10 0.20 BSC 0.30 – 0.50 REF NOTE: 1. DIMENSIONS ARE IN MILLIMETERS 2. DRAWING NOT TO SCALE 3. DIMENSIONS ARE INCLUSIVE OF PLATING 4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR 5. MOLD FLASH SHALL NOT EXCEED 0.254mm 6. JEDEC PACKAGE REFERENCE IS MO-193 3.85 MAX 0.62 MAX 0.95 REF RECOMMENDED SOLDER PAD LAYOUT PER IPC CALCULATOR 1.4 MIN 2.62 REF 1.22 REF Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen- tation that the interconnection of its circuits as described herein will not infringe on existing patent rights. |
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