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MMG3003NT1 Fiches technique(PDF) 13 Page - Freescale Semiconductor, Inc |
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MMG3003NT1 Fiches technique(HTML) 13 Page - Freescale Semiconductor, Inc |
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13 / 16 page ![]() MMG3003NT1 6-13 Freescale Semiconductor RF Product Device Data 1.7 5.33 3.48 0.58 1.27 0.86 3.86 0.64 7.62 2.49 2.54 1.27 0.305 diameter Figure 29. Recommended Mounting Configuration NOTES: 1. THERMAL AND RF GROUNDING CONSIDERATIONS SHOULD BE USED IN PCB LAYOUT DESIGN. 2. DEPENDING ON PCB DESIGN RULES, AS MANY VIAS AS POSSIBLE SHOULD BE PLACED ON THE LANDING PATTERN. 3. IF VIAS CANNOT BE PLACED ON THE LANDING PATTERN, THEN AS MANY VIAS AS POSSIBLE SHOULD BE PLACED AS CLOSE TO THE LANDING PATTERN AS POSSIBLE FOR OPTIMAL THERMAL AND RF PERFORMANCE. 4. RECOMMENDED VIA PATTERN SHOWN HAS 0.381 x 0.762 MM PITCH. Recommended Solder Stencil |
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