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VPA2000 Fiches technique(PDF) 13 Page - Renesas Technology Corp |
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VPA2000 Fiches technique(HTML) 13 Page - Renesas Technology Corp |
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13 / 25 page ![]() VPA2000 Product Data March 11, 2010 13 NUMBER LABEL I/O DESCRIPTION 19 SWN Connection for the drain terminal of the boost power switch. 20 GND1 Ground connections for the boost switch. Route the boost output capacitors ground returns to this pin with the smallest loop area possible. Connect this pin to ground. 21 VIN1 Input Power supply input voltage. Place a decoupling 4.7µF capacitor next to this pin. 22 C1P Positive terminal of flying capacitor required by the charge pump. 23 VCORE Output Output of the built-in charge pump. This pin supplies 1.2V for the core voltage of DP TCON. 24 C1N Negative terminal of flying capacitor required by the charge pump. - PAD Thermal pad. Connect this pad to ground. Use thermal vias and large copper area for improved thermal performance. |
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