MPC604ECSLASHD datasheet(24/32 Pages) NXP

24 / 32 page

604 Hardware Specifications

Preliminary/Subject to Change without Notice

1.6.2.2 Mechanical Dimensions of the BGA Package

Figure 15 provides the mechanical dimensions and bottom surface nomenclature of the IBM and Motorola

BGA package.

Figure 15. Mechanical Dimensions and Bottom Surface Nomenclature of the BGA Package

12 34 56 78 9 10 11 12 13 14 15 16

255X

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

DIM

MIN

MAX

MIN

MAX

INCHES

21.000 BSC

0.827 BSC

MILLIMETERS

21.000 BSC

0.827 BSC

2.300

3.160

0.091

0.124

0.820

0.930

0.032

0.036

1.270 BSC

0.050 BSC

0.790

0.990

0.031

0.039

0.635 BSC

0.025 BSC

5.000 16.000

0.197

0.630

5.000 16.000

0.197

0.630

CORNER

0.200

–F–

0.200

–E–

0.150 T

–T–

0.300

F S

0.150

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

IVE

D B

Y F

INC

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