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APR11/D Fiches technique(PDF) 79 Page - NXP Semiconductors

No de pièce APR11/D
Description  24-BIT DIGITAL SIGNAL PROCESSOR
PDF  101 Pages
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Fabricant  NXP [NXP Semiconductors]
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APR11/D Fiches technique(HTML) 79 Page - NXP Semiconductors

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DSP56001A
Heat Dissipation
MOTOROLA
DSP56001A/D, Rev. 1
4-5
HEAT DISSIPATION
The average chip junction temperature, TJ, in °C, can be obtained from:
Equation 1: T
J = TA + (PD × ΘJA)
Where:
TA = ambient temperature, °C
Θ
JA =
package thermal resistance, junction-to-ambient,
°C/W
PD = PINT + PI/O
PINT = ICC × VCC watt—chip internal power
PI/O = power dissipation on input and output pins—user determined
For most applications PI/O < PINT and PI/O can be neglected. An appropriate relationship between
PD and TJ (if PI/O is neglected) is:
Equation 2: P
D = K / (TJ + 273)
Solving equations (1) and (2) for K gives:
Equation 3: K = P
D × (TA + 273) + PD × ΘJA
Where:
K is a constant pertaining to the particular package
K can be determined from equation (2) by measuring PD (at equilibrium) for a known TA. Using
this value of K, the values of PD and TJ can be obtained by solving equations (1) and (2) iteratively
for any value of TA. The total thermal resistance of a package (ΘJA) can be separated into two
components,
Θ
JC and ΘCA, representing the barrier to heat flow from the semiconductor junction to
the package (case) surface (
Θ
JC) and from the case to the outside ambient (ΘCA). These terms are
related by the equation:
Equation 4:
Θ
JA = ΘJC + ΘCA
Θ
JC is device-related and cannot be influenced by the user. However, ΘCA is user-dependent and
can be minimized by thermal management techniques such as heat sinks, ambient air cooling,
and thermal convection. Thus, good thermal management can significantly reduce
Θ
CA so that
Θ
JA approximately equals ΘJC. Values for thermal resistance presented in this document, unless
estimated, were derived using the procedure described in Motorola Reliability Report 7843,
“Thermal Resistance Measurement Method for MC68XX Microcomponent Devices”, and are
provided for design purposes only. Thermal measurements are complex and dependent on
procedure and setup. User-derived values for thermal resistance may differ.
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com



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