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ISL98607 Fiches technique(PDF) 27 Page - Renesas Technology Corp

No de pièce ISL98607
Description  High Efficiency Power Supply for Small Size Displays
PDF  29 Pages
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Fabricant  RENESAS [Renesas Technology Corp]
Site Internet  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp

ISL98607 Fiches technique(HTML) 27 Page - Renesas Technology Corp

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ISL98607
7. Package Outline Drawings
FN8421 Rev.1.00
Page 27 of 29
Jun.3.19
7.
Package Outline Drawings
W4x5.20E
20 Ball Wafer Level Chip Scale Package (WLCSP) (BSC)
Rev 1, 1/13
NOTES:
Dimensions and tolerance per ASME Y 14.5M - 1994.
Dimension is measured at the maximum bump diameter
parallel to primary datum Z .
Primary datum Z and seating plane are defined by the spherical
crowns of the bump.
Bump position designation per JESD 95-1, SPP-010.
There shall be a minimum clearance of 0.10mm between
the edge of the bump and the body edge.
3.
2.
4.
1.
5.
BOTTOM VIEW
TOP VIEW
SIDE VIEW
RECOMMENDED LAND PATTERN
PIN 1
PACKAGE
0.400
0.05 Z
0.265±0.035
0.200±0.030
0.540±0.050
(4X)
Y
1.200
0.400
1.600
20x 0.265±0.035
12
3
4
0.200
A
B
C
D
E
3
SEATING PLANE
Z
1.82±0.030
(A1 CORNER)
2.15±0.030
0.310
0.275
0.240
0.290
0.10
OUTLINE
0.10
Z X Y
0.05
Z
0.040 BSC
(BACK IDE COATING)
For the most recent package outline drawing, see W4x5.20E.



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