| Moteur de recherche de fiches techniques de composants électroniques |
|
HCS166D Fiches technique(PDF) 9 Page - Renesas Technology Corp |
|
|
|||||||||||||||||||||||||||||
HCS166D Fiches technique(HTML) 9 Page - Renesas Technology Corp |
|
9 / 9 page ![]() HCS166MS FN2482 Rev 2.00 Page 9 of 9 September 1995 Die Characteristics DIE DIMENSIONS: 94 x 94 mils METALLIZATION: Type: AlSi Metal Thickness: 11k Å 1kÅ GLASSIVATION: Type: SiO2 Thickness: 13k Å 2.6kÅ WORST CASE CURRENT DENSITY: < 2.0 x 105A/cm2 BOND PAD SIZE: 100 m x 100m 4 mils x 4 mils Metallization Mask Layout HCS166MS NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location. The mask series for the HCS166 is TA14386A. DS (1) D0 D1 (3) (2) D2 (4) D3 (5) CE (6) (7) CP (8) GND (9) MR (10) D4 (11) D5 VCC (16) PE (15) (14) D7 (13) Q7 (12) D6 |
|
|
Lien URL |
| ALLDATASHEET vous a-t-il été utile ? [ DONATE ] |
À propos de Alldatasheet | Publicité | Contactez-nous | Politique de confidentialité | Lien vers la fiche technique | Echange de liens | Fabricants All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |