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HCS163HMSR Fiches technique(PDF) 9 Page - Renesas Technology Corp |
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HCS163HMSR Fiches technique(HTML) 9 Page - Renesas Technology Corp |
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9 / 9 page ![]() HCS163MS FN3087 Rev 1.00 Page 9 of 9 September 1995 Die Characteristics DIE DIMENSIONS: 104 x 86 mils METALLIZATION: Type: AlSi Metal Thickness: 11k Å 1kÅ GLASSIVATION: Type: SiO2 Thickness: 13k Å 2.6kÅ WORST CASE CURRENT DENSITY: < 2.0 x 105A/cm2 BOND PAD SIZE: 100 m x 100m 4 mils x 4 mils Metallization Mask Layout HCS163MS NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location. The mask series for the HCS163 is TA14348A. MR CP P0 P1 P2 P3 PE GND SPE TE Q3 Q2 Q1 Q0 TC VCC |
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