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HCS157DMSR Fiches technique(PDF) 9 Page - Renesas Technology Corp |
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HCS157DMSR Fiches technique(HTML) 9 Page - Renesas Technology Corp |
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9 / 9 page ![]() HCS157MS FN3561 Rev 1.00 Page 9 of 9 September 1995 GLASSIVATION: Type: SiO2 Thickness: 13k Å 2.6kÅ WORST CASE CURRENT DENSITY: <2.0 x 105A/cm2 BOND PAD SIZE: 100 m x 100m 4 mils x 4 mils Metallization Mask Layout HCS157MS NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location. The mask series for the HCS157 is TA14371A. (14) 4I0 (13) 4I1 (12) 4Y (11) 3I0 (10) 3I1 1I1 (3) 1Y (4) 2I0 (5) 2I1 (6) |
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