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STGAP2GSNC Fiches technique(PDF) 13 Page - STMicroelectronics |
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STGAP2GSNC Fiches technique(HTML) 13 Page - STMicroelectronics |
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13 / 20 page ![]() 10 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 10.1 SO-8 package information Table 10. SO-8 package dimensions Dim. mm Min. Typ. Max. A 1.35 - 1.75 A1 0.10 - 0.25 b 0.35 - 0.49 c 0.19 - 0.25 D(1) 4.8 - 5 E1 3.8 3.9 4 E 5.8 6 6.2 e 1.27 BSC L 0.4 - 1.25 h 0.25 - 0.50 θ 0° 7° Θ1 2° 12° aaa 0.25 bbb 0.25 ccc 0.1 1. Dimension “D” does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.15 mm per side. STGAP2GSN Package information DS14151 - Rev 1 page 13/20 |
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