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STGAP2GS Fiches technique(PDF) 4 Page - STMicroelectronics |
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STGAP2GS Fiches technique(HTML) 4 Page - STMicroelectronics |
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4 / 20 page ![]() 3 Electrical data 3.1 Absolute maximum ratings Table 2. Absolute maximum ratings Symbol Parameter Test condition Min. Max. Unit VDD Logic supply voltage vs. GND - 0.3 6 V VLOGIC Logic pins voltage vs. GND - 0.3 6 V VH Positive supply voltage (VH vs. GNDISO) - 0.3 15 V VOUT Voltage on gate driver outputs (GON, GOFF vs. GNDISO) - 0.3 VH + 0.3 V TJ Junction temperature - 40 150 °C TS Storage temperature - 50 150 °C ESD HBM (human body model) 2 kV 3.2 Recommended operating conditions Table 3. Recommended operating conditions Symbol Parameter Test conditions Min. Max. Unit VDD Logic supply voltage vs. GND 3.1 5.5 V VLOGIC Logic pins voltage vs. GND 0 5.5 V VH Positive supply voltage (VH vs. GNDISO) Max(VHon) 13 V dVH/dt VH Power-up transient VH = 0 to 6 V 100 μs FSW Maximum switching frequency.(1) 2 MHz TJ Operating Junction Temperature -40 125 °C 1. Actual limit depends on power dissipation and TJ 3.3 Thermal data Table 4. Thermal data Symbol Parameter Test condition Value Unit Rth(JA) Thermal resistance junction to ambient JEDEC 2s2p PCB in still air 130 °C/W STGAP2GS Electrical data DS14152 - Rev 1 page 4/20 |
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