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STM32U595AI Fiches technique(PDF) 373 Page - STMicroelectronics

No de pièce STM32U595AI
Description  Ultra-low-power Arm® Cortex®-M33 32-bit MCUTrustZone®FPU,240 DMIPS, up to 4 MB Flash, 2.5 MB SRAM, LTDC, MIPI® DSI
PDF  377 Pages
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Fabricant  STMICROELECTRONICS [STMicroelectronics]
Site Internet  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32U595AI Fiches technique(HTML) 373 Page - STMicroelectronics

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DS13633 Rev 1
373/377
STM32U59xxx
Package information
373
PI/O max represents the maximum power dissipation on output pins:
PI/O max = ∑(VOL * IOL) + ∑((VDDIOx - VOH) * IOH)
taking into account the actual VOL/IOL and VOH/IOH of the I/Os at low and high level in the
application.
6.9.1
Reference documents
•
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air) available on www.jedec.org.
•
For information on thermal management, refer to application note “Thermal
management guidelines for STM32 32-bit Arm Cortex MCUs applications” (AN5036)
available on www.st.com.
Table 167. Package thermal characteristics
Symbol
Parameter
Package
Value
Unit
ΘJA
Thermal resistance junction-ambient
LQFP64 (10 x10 mm)
36.0
°C/W
LQFP100 (14 x 14 mm)
32.2
UFBGA132 (7 x 7 mm)
30.9
LQFP144 (20 x 20 mm)
34.1
WLCSP150 (5.38 x 5.47 mm)
31.7
TFBGA169 (7 x 7 mm)
32.2
WLCSP208 (5.38 x 5.47 mm)
35.4
TFBGA216 (13 x 13 mm)
26.5
ΘJB
Thermal resistance junction-board
LQFP64 (10 x10 mm)
18.3
LQFP100 (14 x14 mm)
18.0
UFBGA132 (7 x 7 mm)
15.9
LQFP144 (20 x 20 mm)
22.9
WLCSP150 (5.38 x 5.47 mm)
13.5
TFBGA169 (7 x 7 mm)
17.7
WLCSP208 (5.38 x 5.47 mm)
12.5
TFBGA216 (13 x 13 mm)
16.0
ΘJC
Thermal resistance junction-case
LQFP64 (10 x 10 mm)
6.8
LQFP100 (14 x 14 mm)
5.9
UFBGA132 (7 x 7 mm)
6.0
LQFP144 (20 x 20 mm)
6.0
WLCSP150 (5.38 x 5.47 mm)
0.9
TFBGA169 (7 x 7 mm)
9.0
WLCSP208 (5.38 x 5.47 mm)
1.0
TFBGA216 (13 x 13 mm)
7.7



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