DFE252012P-2R2M datasheet(38/44 Pages) MICROCHIP

No de pièce	DFE252012P-2R2M

Description	Cost and Size Optimized PMIC for SAMA5DX/SAM9X6/SAMA7G Series MPUs

PDF	44 Pages

Scroll/Zoom	100%

Fabricant	MICROCHIP [Microchip Technology]

Site Internet	http://www.microchip.com

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38 / 44 page

MCP16501

DS20006388A-page 38

 2020 Microchip Technology Inc.

RECOMMENDED LAND PATTERN

Dimension Limits

Units

Optional Center Pad Width

Contact Pad Spacing

Optional Center Pad Length

Contact Pitch

2.80

MILLIMETERS

0.50 BSC

MIN

MAX

4.00

Contact Pad Length (X24)

Contact Pad Width (X24)

0.80

0.30

NOM

Contact Pad Spacing

4.00

Contact Pad to Contact Pad (X20)

0.20

Thermal Via Diameter

Thermal Via Pitch

0.30

1.00

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Contact Pad to Center Pad (X24)

0.20

ØV

SILK SCREEN

Microchip Technology Drawing C04-23387 Rev A

24-Lead Very Thin Plastic Quad Flat, No Lead Package (RMB) - 4x4 mm Body [VQFN]

Atmel Legacy Global Package Code ZZP

DFE252012P-2R2M Fiches technique(PDF) 38 Page - Microchip Technology

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