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P0109DA Fiches technique(PDF) 6 Page - STMicroelectronics |
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P0109DA Fiches technique(HTML) 6 Page - STMicroelectronics |
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6 / 9 page ![]() 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 TO-92 package information • Lead free plating + halogen-free molding resin • Epoxy meets UL94, V0 Figure 12. TO-92 package outline A F C B a D E b c Table 5. TO-92 package mechanical data Ref. Dimensions Millimeters Inches(1) Min. Typ. Max. Min. Typ. Max. A 1.35 0.0531 B 4.70 0.1850 C 2.54 0.1000 D 4.40 0.1732 E 12.70 0.5000 F 3.70 0.1457 a 0.50 0.0197 b 1.27 0.0500 c 0.48 0.0189 1. Inches dimensions given for information P0109DA Package information DS13154 - Rev 2 page 6/9 |
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