| Moteur de recherche de fiches techniques de composants électroniques |
|
M24M01-R Fiches technique(PDF) 41 Page - STMicroelectronics |
|
|
|||||||||||||||||||||||||||||
M24M01-R Fiches technique(HTML) 41 Page - STMicroelectronics |
|
41 / 47 page ![]() DocID12943 Rev 14 41/47 M24M01-R M24M01-DF Package information 46 Figure 22. WLCSP- 8-bump, 2.578 x 1.716 mm, wafer level chip scale package recommended footprint 1. Dimensions are expressed in millimeters. e3 - 0.500 - - 0.0197 - F - 0.425 - - 0.0167 - G - 0.789 - - 0.0311 - aaa - 0.110 - - 0.0043 - bbb - 0.110 - - 0.0043 - ccc - 0.110 - - 0.0043 - ddd - 0.060 - - 0.0024 - eee - 0.060 - - 0.0024 - 1. Values in inches are converted from mm and rounded to 4 decimal digits. 2. Dimension is measured at the maximum bump diameter parallel to primary datum Z. Table 20. WLCSP- 8-bump, with BSC, 2.578 x 1.716 mm, wafer level chip scale package outline (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max |
|
Lien URL |
| ALLDATASHEET vous a-t-il été utile ? [ DONATE ] |
À propos de Alldatasheet | Publicité | Contactez-nous | Politique de confidentialité | Lien vers la fiche technique | Echange de liens | Fabricants All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |