PACKAGE OUTLINE

4226301/D 11/2022

www.ti.com

WQFN-FCRLF - 0.7 mm max height

PLASTIC QUAD FLAT PACK- NO LEAD

RXX0037A

A

0.08 C

6.1

5.9

0.7

0.6

SEATING PLANE

PIN 1 INDEX AREA

C

(0.20) TYP

0.01

0.00

1

0.1

C A B

0.05

C

PIN 1 ID

(OPTIONAL)

B

5.1

4.9

0.000 PKG ℄

37X 0.3

0.2

NOTES:

1.

All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance.

32X 0.5

2X 3.5

2X 4.5

2.25±0.1

0.325±0.1

0.626±0.1

0.625±0.1

2.34±0.1

1.839±0.1

2.089±0.1

0.15±0.1

(0.25) TYP

0.45

0.35

18X 0.45

0.35

(0.2)

0.5

0.4

7

18

28

29

36

37

0.306±0.1

0.3

0.2

10

11

19

20

25

6

24

38

39