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L3G4IS Fiches technique(PDF) 22 Page - STMicroelectronics |
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L3G4IS Fiches technique(HTML) 22 Page - STMicroelectronics |
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22 / 24 page ![]() Package information L3G4IS 22/24 Doc ID 022612 Rev 1 8 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. Figure 8. LGA-16: mechanical data and package dimensions Dimensions Ref. mm inch Min. Typ. Max. Min. Typ. Max. A1 1.000 0.0394 A2 0.7850.0309 A3 0.200 0.0079 d0.300 0.0118 D1 3.850 4.000 4.150 0.1516 0.1575 0.1634 E1 3.850 4.000 4.150 0.1516 0.1575 0.1634 L2 1.950 0.0768 M 0.100 0.0039 N1 0.650 0.0256 N2 0.975 0.0384 P1 1.750 0.0689 P2 1.525 0.0600 T1 0.400 0.0157 T2 0.300 0.0118 k 0.050 0.0020 LGA-16 (4x4x1mm) Land Grid Array Package Outline and 8125097_A mechanical data |
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