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74HC112DB Fiches technique(PDF) 10 Page - NXP Semiconductors |
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74HC112DB Fiches technique(HTML) 10 Page - NXP Semiconductors |
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10 / 15 page ![]() 1998 Jun 10 10 Philips Semiconductors Product specification Dual JK flip-flop with set and reset; negative-edge trigger 74HC/HCT112 PACKAGE OUTLINES X w M θ A A1 A2 b p D HE L p Q detail X E Z e c L v M A (A ) 3 A 8 9 1 16 y pin 1 index UNIT A max. A1 A2 A3 bp cD(1) E (1) (1) eHE LLp QZ y w v θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 10.0 9.8 4.0 3.8 1.27 6.2 5.8 0.7 0.6 0.7 0.3 8 0 o o 0.25 0.1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 1.0 0.4 SOT109-1 95-01-23 97-05-22 076E07S MS-012AC 0.069 0.010 0.004 0.057 0.049 0.01 0.019 0.014 0.0100 0.0075 0.39 0.38 0.16 0.15 0.050 1.05 0.041 0.244 0.228 0.028 0.020 0.028 0.012 0.01 0.25 0.01 0.004 0.039 0.016 0 2.5 5 mm scale SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 |
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