TLMS110., TLMO1100, TLMY1100, TLMG1100, TLMP1100

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Vishay Semiconductors

Rev. 3.4, 06-Oct-2022

12

Document Number: 83173

For technical questions, contact: LED@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

PACKAGE DIMENSIONS in millimeters

Drawing-No.: 6.541-5056.01-4

Issue: 3; 20.01.2022

Not indicated tolerances ± 0.1

Note

•

Solder joints are only formed on the bottom of the component and solder filet will not be observable on the sides of the component

Technical drawings

according to DIN

specifications

No solder joint area,

not intended for soldering

0.6 ± 0.05

0.8 ± 0.1

Bare copper,

no solder joint area

not intended for soldering

Package identification

0.5

A

C