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TLP3549 Fiches technique(PDF) 10 Page - Toshiba Semiconductor |
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TLP3549 Fiches technique(HTML) 10 Page - Toshiba Semiconductor |
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10 / 20 page ![]() TLP3549,TLP3549F 10 18. 18. 18. 18. Land Pattern Dimensions (for reference only) Land Pattern Dimensions (for reference only) Land Pattern Dimensions (for reference only) Land Pattern Dimensions (for reference only) (Unit: mm) TLP3549 Fig. Fig. Fig. Fig. 18.1 18.1 18.1 18.1 Lead forming and taping option Lead forming and taping option Lead forming and taping option Lead forming and taping option (LF1), (TP1), (LF5), (TP5) TLP3549F Fig. Fig. Fig. Fig. 18.2 18.2 18.2 18.2 Lead forming and taping option Lead forming and taping option Lead forming and taping option Lead forming and taping option (LF4), (TP4) 19. 19. 19. 19. Marking Marking Marking Marking TLP3549 TLP3549F 2019-11-14 Rev.5.0 ©2016-2019 Toshiba Electronic Devices & Storage Corporation |
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