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STM32L082CZ Fiches technique(PDF) 111 Page - STMicroelectronics |
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STM32L082CZ Fiches technique(HTML) 111 Page - STMicroelectronics |
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111 / 132 page ![]() DS10688 Rev 7 111/132 STM32L082xx Package information 126 7.1 WLCSP49 package information Figure 34. WLCSP49 - 49-pin, 3.294 x 3.258 mm, 0.4 mm pitch wafer level chip scale package outline 1. Drawing is not to scale. Bottom view Bump side Side view Front view Top view Wafer back side A1 ball location e1 F G e e e2 E D A A2 Detail A A1 bbb Z Detail A (rotated 90 ) Seating plane Note 1 Note 2 Bump 49x eee Z Orientation reference A1 (4x) D E A3 A2 b A038_ME_V1 A1 b aaa ccc ddd Z Z X Y Z |
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