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STM32L062C8 Fiches technique(PDF) 108 Page - STMicroelectronics |
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STM32L062C8 Fiches technique(HTML) 108 Page - STMicroelectronics |
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108 / 124 page ![]() Package information STM32L062x8 108/124 DS10183 Rev 11 Figure 38. Thin WLCSP36 - 2.61 x 2.88 mm, 0.4 mm pitch wafer level chip scale package recommended footprint Table 74. Thin WLCSP36 - 2.61 x 2.88 mm, 0.4 mm pitch wafer level chip scale package mechanical data Symbol millimeters inches(1) 1. Values in inches are converted from mm and rounded to the 3rd decimal place. Min Typ Max Min Typ Max A - - 0.33 - - 0.013 A1 - 0.10 - - 0.004 - A2 - 0.20 - - 0.008 - A3 - 0.025(2) 2. Back side coating. Nominal dimension rounded to the 3rd decimal place results from process capability. -- 0.001 - b 0.16 0.19 0.22 0.006 0.007 0.009 D 2.59 2.61 2.63 0.102 0.103 0.104 E 2.86 2.88 2.90 0.112 0.113 0.114 e - 0.40 - - 0.016 - e1 - 2.00 - - 0.079 - e2 - 2.00 - - 0.079 - F - 0.305(3) 3. Calculated dimensions are rounded to 3rd decimal place. -- 0.012 - G - 0.440(3) -- 0.017 - aaa - - 0.10 - - 0.004 bbb - - 0.10 - - 0.004 ccc - - 0.10 - - 0.004 ddd - - 0.05 - - 0.002 eee - - 0.05 - - 0.002 MS18965V2 Dsm Dpad |
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