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STM32G081CB Fiches technique(PDF) 75 Page - STMicroelectronics

No de pièce STM32G081CB
Description  Arm® Cortex®-M0 32-bit MCU, 128 KB Flash, 36 KB RAM,4x USART, timers, ADC, DAC, comm. I/Fs, AES, RNG, 1.7-3.6V
PDF  136 Pages
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Fabricant  STMICROELECTRONICS [STMicroelectronics]
Site Internet  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32G081CB Fiches technique(HTML) 75 Page - STMicroelectronics

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DS12231 Rev 4
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STM32G081xB
Electrical characteristics
108
Figure 20. HSI16 frequency vs. temperature
Low-speed internal (LSI) RC oscillator
tstab(HSI16)(2)
HSI16 oscillator stabilization time
-
-
3
5
μs
IDD(HSI16)(2)
HSI16 oscillator power consumption
-
-
155
190
μA
1. Based on characterization results, not tested in production.
2. Guaranteed by design.
Table 41. HSI16 oscillator characteristics(1) (continued)
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
MSv39299V1
15.6
15.7
15.8
15.9
16
16.1
16.2
16.3
16.4
MHz
min
mean
max
+1%
-1%
+2%
-2%
+1.5%
-1.5%
-40
-20
0
20
40
60
80
100
120 °C
Table 42. LSI oscillator characteristics(1)
Symbol
Parameter
Conditions
Min
Typ
Max Unit
fLSI
LSI frequency
VDD = 3.0 V, TA = 30 °C
31.04
-
32.96
kHz
VDD = 1.62 V to 3.6 V, TA = -40 to
125 °C
29.5
-
34
tSU(LSI)(2)
LSI oscillator start-up time
-
-
80
130
μs
tSTAB(LSI)(2) LSI oscillator stabilization time 5% of final frequency
-
125
180
μs
IDD(LSI)(2)
LSI oscillator power
consumption
-
-
110
180
nA
1. Based on characterization results, not tested in production.
2. Guaranteed by design.



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