t

KTS1675A

August 2020 - Revision 04e

Page 3

Company Confidential

Absolute Maximum Ratings1

(TA = 25°C unless otherwise noted)

Symbol

Description

Value

Units

IN

Input Voltage

-0.3 to 28

V

OUT

Output Voltage

-0.3 to 28

V

IN-OUT

IN to OUT Voltage (when OFF)

-28 to 28

V

EN

̅̅̅̅, FLAG

̅̅̅̅̅̅̅̅, WRX

̅̅̅̅̅̅̅, VSNS

EN

̅̅̅̅, FLAG

̅̅̅̅̅̅̅̅, and WRX

̅̅̅̅̅̅̅ and VSNS pins

-0.3 to 6

V

IN, OUT Current

Continuous Current

5

A

TJ

Operating Junction Temperature Range

-40 to 150

°C

Ts

Storage Temperature Range

-65 to 150

°C

TLEAD

Maximum Soldering Temperature (at leads, 10 sec)

260

°C

Thermal Capabilities

Symbol

Description

Value

Units

θJA

Thermal Resistance

– Junction to Ambient2

65

°C/W

PD

Maximum Power Dissipation at TA

≤ 25°C

1919

mW

ΔPD/ΔT

Derating Factor Above TA = 25°C

-15.4

mW/°C

Ordering Information

Part Number

Marking

Operating

Temperature

Package

KTS1675AEUT-TR

NUXXYYZZZZ3

-40°C to +85°C

WLCSP-20

Recommended Operating Condition4

Description

Value

IN Voltage Range

3.0V to 24V

OUT Voltage Range

3.0V to 24V

Ambient Temperature

-40°C to +85°C

Input capacitance (CIN)

Up to 10

F

OTG hot swap capacitance (COTG)

Up to 200

F

Output capacitance (COUT)

Up to 20

F

VSNS capacitance (CVSNS)

Up to 1

F

1. Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device.

Functional operation at

conditions other than the operating conditions specified is not implied. Only one Absolute Maximum rating should be applied at any one

time.

2. Junction to Ambient thermal resistance is highly dependent on PCB layout. Values are based on thermal properties of the device when

soldered to a 4-layer board.

3. XX = Date Code, YY = Assembly Code, ZZZZ = Serial Number.

4. The device is not guaranteed to function outside of recommended operating condition.