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MHD2805SF/883 Fiches technique(PDF) 9 Page - Interpoint Corporation Company |
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MHD2805SF/883 Fiches technique(HTML) 9 Page - Interpoint Corporation Company |
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9 / 11 page ![]() B8-26 CASE K CASES Materials Header Case K1 - K3 Cold Rolled Steel/Nickel/Gold Cases K4 - K8 Cold Rolled Steel/Nickel/Tin Cover Case K1 - K3 Kovar/Nickel Case K4 - K8 Cold Rolled Steel/Nickel/Tin Pins #52 alloy (all cases) Case K1, K2, and K3 (except MHV Series Single and Dual) ceramic seal Cases K4 - K8 and MHV Series Single and Dual (K3) compression glass seal Case dimensions in inches (mm) Tolerance ±0.005 (0.13) for three decimal places ±0.01 (0.2) for two decimal places unless otherwise specified CASE K BOTTOM VIEW See Figures 42 - 48 for pin configuration CAUTION Heat from reflow or wave soldering may damage the device. Solder pins individually with heat application not exceeding 300 °C for 10 seconds per pin. Flange Thickness: Cases K1, K2, K3 and MLP Series (K5) 0.060 (1.52) Cases K4, K5 (except MLP Series), K6, K7, and K8 0.067 +0.005/-0.007 (1.70 +0.13/-0.8) 1.125 max (28.58) 2.910 max (73.91) Dot on top of case indicates pin one FIGURE 41: CASE K MAXIMUM DIMENSIONS |
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