LTC4292 datasheet(42/44 Pages) AD

42 / 44 page

LTC9101-2/LTC9102

Rev. 0

For more information www.analog.com

PACKAGE DESCRIPTION

4.00 ±0.10

(4 SIDES)

NOTE:

1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGGD-X)—TO BE APPROVED

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE, IF PRESENT

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON THE TOP AND BOTTOM OF PACKAGE

PIN 1

TOP MARK

(NOTE 6)

0.40 ±0.10

BOTTOM VIEW—EXPOSED PAD

2.45 ±0.10

(4-SIDES)

0.75 ±0.05

R = 0.115

TYP

0.25 ±0.05

0.50 BSC

0.200 REF

0.00 – 0.05

(UF24) QFN 0105 REV B

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

0.70 ±0.05

0.25 ±0.05

0.50 BSC

2.45 ±0.05

(4 SIDES)

3.10 ±0.05

4.50 ±0.05

PACKAGE OUTLINE

PIN 1 NOTCH

R = 0.20 TYP OR

0.35

× 45° CHAMFER

UF Package

24-Lead Plastic QFN (4mm

× 4mm)

(Reference LTC DWG # 05-08-1697 Rev B)

LTC4292 Fiches technique(PDF) 42 Page - Analog Devices

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