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STEC01 Fiches technique(PDF) 16 Page - STMicroelectronics |
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STEC01 Fiches technique(HTML) 16 Page - STMicroelectronics |
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16 / 22 page ![]() Table 5. VFQFPN 3x3x0.9 mechanical data Symbol Milimeters Min Typ Max A 0.80 0.90 1.00 A1 0 0.02 0.05 A3 0.20 b 0.18 0.25 0.30 D 3.00 D2 1.55 1.70 1.80 E 3.00 E2 1.55 1.70 1.80 e 0.50 L 0.20 0.30 0.40 K 0.20 aaa 0.05 bbb 0.10 ccc 0.10 ddd 0.05 eee 0.08 Note: VFQFPN - standard for thermally enhanced very thin fine pitch quad flat package no leads. The leads size is comprehensive of the thickness of the leads finishing material. Dimensions do not include mold protrusion, not to exceed 0,15 mm. Package outline exclusive of metal burr dimensions. STEC01 VFQFPN 3x3x0.9 16L package information DS13063 - Rev 2 page 16/22 |
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