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FDA802SB Fiches technique(PDF) 9 Page - STMicroelectronics |
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FDA802SB Fiches technique(HTML) 9 Page - STMicroelectronics |
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9 / 15 page ![]() Symbol Dimensions in mm Min. Typ. Max. A1 -0.04 - 0.04 A2 1.35 1.40 1.45 b 0.17 0.22 0.27 b1 0.17 0.20 0.23 c 0.09 - 0.20 c1 0.09 - 0.16 D 12.00 BSC D1(1) (2) 10.00 BSC D2 See VARIATIONS D3 See VARIATIONS e 0.50 BSC E 12.00 BSC E1(1)(2) 10.00 BSC E2 See VARIATIONS E3 See VARIATIONS L 0.45 0.60 0.75 L1 1.00 REF N 64 R1 0.08 - - R2 0.08 - 0.20 S 0.20 - - Tolerance of form and position aaa 0.20 bbb 0.20 ccc 0.08 ddd 0.08 VARIATIONS Pad option 6.0x6.0 (T1-T3)(3) D2 - - 6.61 E2 - - 6.61 D3 4.8 - - E3 4.8 - - 1. Dimensions D1 and E1 do not include mold flash or protrusions. Allowable mold flash or protrusion is “0.25 mm” per side. 2. The Top package body size may be smaller than the bottom package size of 0.15 mm. 3. Number, dimensions and position of groves shown in Figure 5 are for reference only. FDA802SB LQFP64 (10x10x1.4 mm exp. pad up) package information DB4551 - Rev 1 page 9/15 |
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